The 3D IC market will register a CAGR of about 18% by 2023

LONDON, March 26, 2019 /PRNewswire/ — About this market

The major factor bolstering the growth of the global 3D IC market is the significant growth of the lot. The loT is driving the demand for connected devices. This has significantly increased bandwidth necessities. Different vendors across the market are working collectively to address the need of connecting several products such as home appliances, smart homes, set-top boxes (STBs), and sensors with a common interacting standard. The standard would facilitate interoperability with the extensive variety of smart devices. The demand for small-sized gadgets has increased the need for more functionalities on a single device. This requires 3D IC chips with a greater number of transistors to support more functionalities. In addition, the loT requires the application of processors, multiple embedded cores, graphics processing unit (GPUs), and integrated wireless connectivity in a single package. This is expected to drive the growth of the global 3D IC market during the forecast period. Analysts have predicted that the 3D IC market will register a CAGR of about 18% by 2023.

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Market Overview

Growing requirement for semiconductor devices

The demand for semiconductor devices such as processors Cs, sensors, memory ICs, radio frequency integrated circuit, and others has grown significantly over the last few years. The emergence of the 3D packaging technology has enabled manufacturers to integrate more functionalities into a single chip (3D IC) at a moderate price. These technology advances fueled by the Internet have increased and will continue to augment the penetration of semiconductor devices in many varied application areas.

High design complexity

The increased demand for miniaturized electronic devices such as tablets has resulted in a high level of integration of components such as memory modules, sensors, and others on a single IC. Vendors need to make significant R&D investments in developing high-performance and power-efficient semiconductor ICs. Also, the complexity in manufacturing due to constant miniaturization increases the production cycle time for vendors and causes delays in product delivery. These factors can lead to additional expenses.

For the detailed list of factors that will drive and challenge the growth of the 3D IC market during the 2019-2023, view our report.

Competitive Landscape

The market appears to be highly concentrated and with the presence of limited vendors. This market research report will help clients identify new growth opportunities and design unique growth strategies by providing a comprehensive analysis of the market’s competitive landscape and offering information on the products offered by companies.

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